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In the field of semiconductor packaging, wire bonding technology occupies an important position and is the core method for achieving electrical connection between semiconductor chips and pins. This technology plays a crucial role in the transmission of current between chips and the outside world, ensuring stable and efficient flow of current in and out. At present, as one of the key materials for semiconductor packaging, bonding wire has been applied in over 90% of chip interconnect scenarios.
Industry pain points
As a key material for semiconductor packaging, bonding wire has complex production and high quality requirements. The traditional rewinding process mainly relies on manual labor, which is not only labor-intensive but also susceptible to human factors, resulting in quality risks. For this purpose, the customer chose the Fuwei Intelligent Collaborative Robot for production line renovation, utilizing its safe, reliable, and flexible deployment characteristics to achieve automation of the rewinding process, reduce labor intensity, and improve product quality and production efficiency.
Solution
Flexible deployment to achieve flexible production
Fuwei intelligent collaborative robots can efficiently cope with challenges such as high height and heavy wire of rewinding machines, perfectly matching the picking and placing needs of rewinding machines and material cabinets. It can complete loading and unloading work in narrow spaces without changing the layout of the production line, reducing the impact of production line upgrades on working hours. At the same time, robots can preset multiple programs to quickly switch production tasks, simplify operations, significantly reduce production line switching time, and improve overall production efficiency.
Enhance productivity and unlock exceptional performance
In the bonding wire production workshop, manual loading and unloading operations in the rewinding process are both laborious and prone to injury to workers. To ensure 24-hour continuous production and reduce equipment depreciation costs, the customer has introduced Fuwei intelligent collaborative robots to achieve automated loading and unloading. This robot can serve two rewinding machines simultaneously, improving production efficiency, reducing labor costs, ensuring product consistency, enhancing market competitiveness, and ensuring worker health and safety.
Advantages of the plan:
Before the bonding wire leaves the factory, the perfect combination of Fuwei intelligent collaborative robot and machine vision is used to accurately inspect the surface quality, wire laying, and wiring of the bonding wire. Through the analysis of image data, robots can accurately identify defective products, thereby comprehensively improving production efficiency and greatly reducing the risk of missed detections in manual inspection. At the same time, cloud storage and visual display of data have been achieved, providing strong support for production decision-making.
The application of collaborative robots in the field of semiconductor packaging not only promotes the rapid development of the semiconductor manufacturing industry with their precise operation, flexible adaptability, and efficient production capacity, but also brings significant economic benefits and market competitiveness to enterprises.
